CIT Requirements for Soldered Electrical and Electronic Assemblies 4

Question 1

When inspecting a through-hole solder joint per IPC J-STD-001, which condition is classified as a 'defect' for Class 3?

Accepted Answer

Solder fill of 75% hole fill

Answer

Class 3 requires a minimum of 75% vertical fill of the plated through-hole — wait, actually Class 3 requires minimum 75% fill, but let me correct: Class 3 requires minimum 75% hole fill; less than 75% is a defect.

Question 2

What does the 'J-STD' designation stand for in IPC J-STD-001?

Accepted Answer

Joint Standard

Answer

J-STD stands for 'Joint Standard,' indicating the document was developed jointly by IPC and EIA (Electronic Industries Alliance).

Question 3

Per IPC J-STD-001, what is required when mixing lead-free and tin-lead solders in a production environment?

Accepted Answer

Separate process controls, documentation, and equipment to prevent contamination

Answer

Mixing lead-free and tin-lead alloys (mixed metallurgy) requires segregated equipment and documentation due to reliability concerns from alloy incompatibility.

Question 4

Which IPC document is the companion inspection document to IPC J-STD-001 for solder joint acceptability?

Accepted Answer

IPC-A-610

Answer

IPC-A-610 (Acceptability of Electronic Assemblies) is the companion inspection document that provides visual criteria and illustrations for accepting or rejecting solder joints.

Question 5

Per IPC J-STD-001, which condition describes 'non-wetting' in a solder joint?

Accepted Answer

Molten solder fails to adhere to the base metal surface at all

Answer

Non-wetting means the solder does not bond to the base metal surface at all, typically because of heavy oxidation or contamination on the substrate.

(CIT) Certified IPC Trainer Practice Test

(CIT) Certified IPC Trainer Practice Test

CIT Requirements for Soldered Electrical and Electronic Assemblies 4