CIT Rework, Modification, and Repair of Electronic Assemblies

Question 1

What is the primary goal of rework in electronics manufacturing?

Accepted Answer

To correct defects and meet compliance

Answer

To redesign the PCB

Answer

To increase production output

Answer

To apply conformal coating

Question 2

Which IPC standard is used for rework and repair of electronic assemblies?

Accepted Answer

IPC-7711/21

Answer

IPC-A-610

Answer

IPC-2221

Answer

IPC-J-STD-001

Question 3

What should be done before modifying a circuit trace or pad?

Accepted Answer

Obtain approval from engineering

Answer

Document the original design

Answer

Apply solder mask

Answer

Replace the board

Question 4

Which of the following is a key risk during hot air rework of components?

Accepted Answer

Excessive heat causing pad damage

Answer

Color mismatch

Answer

Slower soldering process

Answer

Extra flux residue

Question 5

What is the difference between rework and repair in IPC-7711/21?

Accepted Answer

Rework corrects defects; repair restores function

Answer

Rework is permanent, repair is temporary

Answer

Rework is for engineers only

Answer

Repair cannot be documented

Question 6

Which method is acceptable for removing a through-hole component?

Accepted Answer

Use a vacuum desoldering tool

Answer

Cut the leads and pull forcefully

Answer

Heat with an open flame

Answer

Soak in solvent overnight