CIT Acceptability of Electronic Assemblies 3

Question 1

For a chip component (0402) on a Class 2 assembly, the maximum side overhang allowable relative to the land is:

Accepted Answer

50% of component width

Answer

IPC-A-610 allows up to 50% side overhang for chip components on Class 2 assemblies before it becomes a defect.

Question 2

What is the IPC-A-610 term for a solder joint condition where solder has not wetted the component termination or land surface?

Accepted Answer

Nonwetting

Answer

Nonwetting occurs when solder fails to wet and adhere to the base metal surface at all.

Question 3

A gull-wing lead's toe extends beyond the land end on a Class 2 assembly. Per IPC-A-610, this is:

Accepted Answer

Acceptable if the solder joint criteria are met

Answer

Toe overhang on gull-wing leads is acceptable for Class 2 provided the solder joint meets all other criteria.

Question 4

According to IPC-A-610, 'lifted lands' or pad liftoff is classified as:

Accepted Answer

A defect for all classes

Answer

Lifted lands/pad liftoff is a defect condition for all classes per IPC-A-610.

Question 5

For BGA components, IPC-A-610 inspection of solder joints typically relies primarily on:

Accepted Answer

X-ray inspection or automated optical inspection

Answer

BGA joints are hidden under the package and require X-ray or AOI for inspection per IPC-A-610 guidance.

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