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Requirements for Soldered Electrical and Electronic Assemblies Flashcards

7 cards from real CIT practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.

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  1. Under IPC J-STD-001, which class of product has the MOST stringent soldering requirements?

    Answer: Class 3 (High Reliability Electronics)

    Class 3 (High Reliability Electronics) has the most stringent requirements, covering equipment where continued performance is critical and downtime cannot be tolerated.

  2. What is the maximum allowable solder ball diameter per IPC J-STD-001 for Class 2 assemblies?

    Answer: 0.25 mm (0.010 in)

    For Class 2 assemblies, solder balls must not exceed 0.13 mm (0.005 in) in diameter to be acceptable per IPC J-STD-001.

  3. In IPC J-STD-001, 'dewetting' is defined as a condition where:

    Answer: Solder initially wets the surface but then recedes, leaving an irregular mounded appearance

    Dewetting occurs when molten solder coats a surface and then pulls back, leaving irregular mounds of solder with base metal exposed between them.

  4. What is the primary purpose of activated flux in the soldering process?

    Answer: To remove oxides from metal surfaces to allow proper wetting

    Activated flux chemically removes oxide layers from metal surfaces, enabling the molten solder to wet and bond properly to the base metal.

  5. Per IPC J-STD-001, a solder bridge between two conductors that are supposed to be electrically isolated is classified as:

    Answer: A defect for all product classes

    A solder bridge between isolated conductors is a defect for all product classes (1, 2, and 3) because it creates an unintended electrical short circuit.

  6. Which lead-free solder alloy is most commonly specified as the industry standard replacement for Sn63Pb37?

    Answer: SAC305 (Sn96.5Ag3Cu0.5)

    SAC305 (96.5% tin, 3% silver, 0.5% copper) is the most widely adopted lead-free solder alloy and is considered the industry-standard replacement for tin-lead solder.

  7. Per IPC J-STD-001, what is the consequence of using a soldering iron tip temperature that is excessively high?

    Answer: Potential component damage, PCB delamination, and pad lifting

    Excessive soldering iron temperature can damage heat-sensitive components, cause PCB delamination, lift pads, and degrade solder joint integrity.