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Rework, Modification, and Repair of Electronic Assemblies Flashcards

7 cards from real CIT practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.

Read the first 7 Rework, Modification, and Repair of Electronic Assemblies flashcards as text

  1. What is the primary reason for pre-baking PCB assemblies before BGA rework?

    Answer: To remove absorbed moisture and prevent popcorning

    Pre-baking drives out absorbed moisture from the PCB and component packages, preventing steam-induced delamination (popcorning) during reflow.

  2. When repairing a lifted SMT pad, the technician must ensure the epoxy adhesive cure extends under the replacement pad. Why is this critical?

    Answer: To provide mechanical anchoring so the pad does not lift again under thermal cycling

    Epoxy under the replacement pad anchors it mechanically so thermal expansion and contraction during cycling do not cause re-lifting.

  3. According to IPC-A-610, a solder joint on a Class 2 through-hole assembly is acceptable if solder fill in the barrel is a minimum of:

    Answer: 50%

    IPC-A-610 requires a minimum of 50% barrel fill for Class 2 through-hole solder joints to be considered acceptable.

  4. A technician must repair a cracked solder joint on a BGA ball that is not accessible for direct inspection. What technique is used to verify joint quality after repair?

    Answer: X-ray inspection (2D or 3D)

    X-ray inspection (2D or 3D CT) is used to verify BGA solder joint quality, including voids and opens, because the joints are hidden beneath the package.

  5. During chip removal on an SMT assembly, which tool setup is preferred to avoid pad damage on a 0201 component?

    Answer: Tweezers with hot-air rework station at controlled temperature

    Tweezers combined with a controlled hot-air station allows simultaneous reflow of both terminations, preventing pad damage from mechanical force.

  6. What does the term 'orange peel' describe in the context of conformal coating rework?

    Answer: A surface texture defect indicating improper curing or application of conformal coat

    Orange peel describes a rough, dimpled surface texture in conformal coating resulting from improper application viscosity or curing conditions.

  7. When selecting a replacement component for repair, IPC-7711/7721 requires that the replacement part must be:

    Answer: Electrically equivalent and meet or exceed the original component specifications

    IPC-7711/7721 requires that replacement components be electrically equivalent and meet or exceed original specifications to maintain assembly reliability.