← All SE ENGR. Flashcard Decks

Quality Assurance Flashcards

7 cards from real SE ENGR. practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.

Read the first 7 Quality Assurance flashcards as text
  1. Which test sequence in IEC 61215 cycles modules between -40°C and +85°C to stress solder joints and interconnects?

    Answer: Thermal cycling

    Thermal cycling (e.g., TC200) between -40°C and +85°C stresses interconnects through thermal expansion mismatch.

  2. On a measured I-V curve, a noticeably reduced slope near Voc (flatter than expected) most strongly suggests which problem?

    Answer: Increased series resistance

    Higher series resistance from corroded contacts or degraded solder bonds flattens the curve near Voc and lowers fill factor.

  3. What is the primary purpose of the wet leakage current test on PV modules?

    Answer: Verify insulation integrity under wet operating conditions

    The wet leakage current test confirms that moisture cannot create hazardous leakage paths to the frame or surroundings.

  4. Potential-induced degradation (PID) screening per IEC TS 62804-1 commonly uses which stress condition?

    Answer: 60°C, 85% RH, 96 hours at rated system voltage

    The common PID test applies rated system voltage between cells and frame at 60°C/85% RH for 96 hours.

  5. Which acceptance sampling standard is widely used in the US for incoming inspection of PV components by attributes?

    Answer: ANSI/ASQ Z1.4

    ANSI/ASQ Z1.4 provides AQL-based sampling plans for inspection by attributes.

  6. A process has a Cpk of 0.85 for module frame hole spacing. What does this indicate?

    Answer: The process is not capable of consistently meeting specifications

    A Cpk below 1.0 means a meaningful fraction of output falls outside specification limits; 1.33 or higher is a common target.

  7. Why should PV connectors from different manufacturers not be cross-mated even if they look compatible?

    Answer: Mismatched tolerances can cause high resistance, heating, arcing, and void listings

    Cross-mated connectors are not evaluated together, so poor contact can cause overheating and arc faults and voids certification.