PCB Signal Integrity & EMC 2

Question 1

What does EMC stand for in the context of PCB design and electronic system compliance?

Accepted Answer

Electromagnetic Compatibility

Answer

Electronic Module Control

Answer

Embedded Memory Circuit

Answer

Electromechanical Coupling

Question 2

Which PCB design strategy most effectively reduces radiated EMI emissions from a high-speed PCB?

Accepted Answer

Minimizing current loop areas in signal return paths

Answer

Using wider power traces

Answer

Adding more mounting holes

Answer

Increasing PCB substrate thickness

Question 3

What is the primary EMC function of a solid copper ground plane in a multilayer PCB stackup?

Accepted Answer

Serving as a low-impedance return path for signal currents

Answer

Providing mechanical rigidity to the board

Answer

Increasing PCB layer count

Answer

Improving solder joint quality

Question 4

What happens to the impedance of a real bypass capacitor at frequencies above its self-resonant frequency (SRF)?

Accepted Answer

It increases as the component behaves inductively due to ESL

Answer

It decreases as frequency increases

Answer

It remains constant

Answer

It becomes zero

Question 5

What is the '20-H rule' applied to PCB power plane design?

Accepted Answer

The power plane edge should be recessed inward by 20 times the dielectric separation from the board edge

Answer

Power planes must extend 20mm beyond the board edge

Answer

Ground vias must be placed every 20mm around the perimeter

Answer

Power traces must be at least 20 mils wide

Question 6

Which filter type is most commonly placed at PCB board edges and I/O connectors to suppress high-frequency conducted EMI?

Accepted Answer

Low-pass filter

Answer

High-pass filter

Answer

Band-pass filter

Answer

Notch filter

Question 7

Why are stitching vias placed near signal vias that transition between routing layers in a multilayer PCB?

Accepted Answer

To provide a low-inductance return current path between reference planes at the layer transition

Answer

To increase mechanical bond strength between layers

Answer

To improve via plating quality

Answer

To reduce thermal resistance at the via location