CIS CIS Acceptability Criteria & Defect Recognition

Question 1

According to IPC-A-610, a 'process indicator' is best described as:

Accepted Answer

An anomaly that does not affect form, fit, or function but warrants monitoring

Answer

A process indicator is a condition that does not affect form, fit, or function but indicates the manufacturing process may be marginal and should be monitored.

Question 2

What is the IPC-A-610 acceptability condition for a solder bridge between two conductors that should not be electrically connected?

Accepted Answer

A defect for all classes

Answer

A solder bridge creating an unintended electrical connection between conductors is a defect for all IPC classes (1, 2, and 3).

Question 3

For IPC Class 3, a lifted land (pad lifting from the board surface) on a through-hole component is:

Accepted Answer

A defect

Answer

For IPC Class 3 high-reliability products, any lifted land is a defect because it compromises the reliability of the solder connection.

Question 4

According to IPC-A-610, what is the maximum allowable percentage of a solder joint's height that may be voided for Class 2 SMT components?

Accepted Answer

25%

Answer

IPC-A-610 allows up to 25% voiding by area in solder joints for Class 2 assemblies when inspected by X-ray.

Question 5

A 'cold solder joint' is characterized by:

Accepted Answer

A dull, grainy, or crystalline surface texture indicating insufficient heat during soldering

Answer

A cold solder joint has a dull, grainy, or crystalline appearance caused by inadequate heat during soldering, resulting in poor wetting and weak mechanical/electrical bonds.

(CIS) Certified IPC Specialist Practice Test

(CIS) Certified IPC Specialist Practice Test

CIS CIS Acceptability Criteria & Defect Recognition