CID Design for Testability & Reliability

Question 1

What is the primary goal of Design for Testability (DFT)?

Accepted Answer

To ease fault detection during manufacturing

Answer

To improve signal speed

Answer

To reduce copper thickness

Answer

To increase component count

Question 2

Which technique is commonly used to improve testability in PCBs?

Accepted Answer

Boundary scan

Answer

Thermal management

Answer

Solder mask application

Answer

Via filling

Question 3

What does reliability testing assess in PCB design?

Accepted Answer

Durability and performance under stress

Answer

Signal speed

Answer

Copper plating thickness

Answer

Component placement

Question 4

How does Design for Reliability (DFR) complement DFT?

Accepted Answer

It improves robustness and lifespan

Answer

It reduces cost

Answer

It improves test speed

Answer

It increases component count

Question 5

What is the role of built-in self-test (BIST) in PCBs?

Accepted Answer

Automated self-testing

Answer

Manual fault detection

Answer

Signal boosting

Answer

Thermal management

Question 6

Which factor most affects PCB reliability?

Accepted Answer

Thermal cycling and mechanical stress

Answer

Color of solder mask

Answer

Copper thickness

Answer

Trace width

Question 7

What does fault coverage indicate in testability?

Accepted Answer

Percentage of faults detected

Answer

Time taken to test

Answer

Cost of testing

Answer

Power consumption

Question 8

Why is modular design beneficial for testability?

Accepted Answer

Simplifies diagnostics by isolating sections

Answer

Increases overall cost

Answer

Decreases signal speed

Answer

Improves copper adhesion

Question 9

What is the benefit of using test points on a PCB?

Accepted Answer

Provide accessible locations for testing

Answer

Increase component density

Answer

Reduce signal speed

Answer

Improve solder mask adhesion