CPT Flexible Packaging Technologies 2

Question 1

Which lamination process applies adhesive to one substrate and bonds it to a second substrate under pressure without using heat?

Accepted Answer

Solventless lamination

Answer

Solventless lamination uses a 100% solids adhesive system that requires no drying oven, bonding substrates at room or slightly elevated temperature under nip pressure.

Question 2

In flexible packaging, what is the primary purpose of a slip additive incorporated into a polyethylene film?

Accepted Answer

Reduce coefficient of friction for handling and machinability

Answer

Slip additives migrate to the film surface and reduce COF, allowing the film to run smoothly on packaging equipment and preventing blocking.

Question 3

A flexible pouch fails a burst test at the bottom seal but passes at the side seals. What is the most likely root cause?

Accepted Answer

Insufficient dwell time at the bottom seal bar

Answer

Insufficient dwell time prevents complete polymer fusion at the bottom seal bar, creating a weaker bond that fails under internal pressure before properly formed side seals.

Question 4

What does the term 'retort packaging' specifically refer to in flexible packaging?

Accepted Answer

Flexible pouches or trays that withstand high-temperature sterilization (typically 121°C)

Answer

Retort packaging withstands sterilization temperatures of 121°C (250°F) or higher under pressure, allowing shelf-stable food products without refrigeration.

Question 5

Which property of EVOH film is most significantly reduced when the material is exposed to high humidity conditions?

Accepted Answer

Oxygen barrier performance

Answer

EVOH is highly moisture-sensitive; absorbed water disrupts the polymer chain interaction that provides its excellent oxygen barrier, causing barrier performance to drop dramatically at high RH.

(CPT) Certified Packaging Technologist Practice Test

(CPT) Certified Packaging Technologist Practice Test

CPT Flexible Packaging Technologies 2