CPCT Grounding, Bonding & Electrical Protection 2

Question 1

A surge protector for telecommunications equipment should be bonded to the grounding system at which point?

Accepted Answer

At the TGB in the same telecommunications room

Answer

At the equipment it protects, using the equipment chassis as the ground reference

Answer

At the nearest water pipe to reduce conductor length

Answer

At the electrical panel serving the floor

Question 2

What is the maximum resistance typically specified for a telecommunications grounding system measured from the TMGB to the grounding electrode?

Accepted Answer

TIA-607 does not specify a maximum resistance value

Answer

25 ohms

Answer

10 ohms

Answer

5 ohms

Question 3

Which of the following is NOT an acceptable grounding electrode for telecommunications systems per the NEC?

Accepted Answer

Plastic water supply pipe

Answer

Metal underground water pipe

Answer

Concrete-encased electrode (Ufer ground)

Answer

Ground ring surrounding the building

Question 4

Equipotential bonding in a data center telecommunications room is intended to:

Accepted Answer

Ensure all metallic components are at the same electrical potential to prevent shock and equipment damage

Answer

Increase the impedance of the grounding system to filter high-frequency noise

Answer

Replace the need for individual equipment grounding conductors

Answer

Allow telecommunications equipment to share a ground with elevator systems

Question 5

What type of conductor insulation color is typically required for TBB conductors to distinguish them from power system grounding conductors?

Accepted Answer

Orange or yellow

Answer

Green or green with yellow stripe

Answer

White or gray

Answer

TIA-607 and NEC allow any color for TBB conductors

Question 6

When a TGB must be installed more than 6 meters from the TMGB, what is required per TIA-607?

Accepted Answer

The TBB conductor size must be increased according to the TIA-607 table

Answer

An additional grounding electrode must be driven into the earth at each TGB location

Answer

A second parallel TBB conductor must be run alongside the first

Answer

The TGB must be replaced with a second TMGB

Question 7

Which of the following best describes the difference between grounding and bonding in telecommunications installations?

Accepted Answer

Grounding connects equipment to earth potential; bonding connects metallic components together to equalize potential

Answer

Grounding and bonding are identical terms used interchangeably in TIA-607

Answer

Bonding connects equipment to earth; grounding connects metallic components to each other

Answer

Grounding applies only to power systems; bonding applies only to data systems