(CIS) Certified IPC Specialist Practice Test
CIS CIS Acceptability Criteria & Defect Recognition 2
What is 'tombstoning' in the context of SMT assembly?
Select your answer
A
A type of solder bridge between adjacent pads
B
A defect where one end of a chip component lifts off its pad during reflow
C
Excessive solder forming a columnar shape on a pad
D
A component placed at 90° to its intended orientation
Hint