Quality Control & Inspection Procedures Flashcards
7 cards from real CIS practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.
Read the first 7 Quality Control & Inspection Procedures flashcards as text
Which IPC standard specifically covers the qualification and performance of flexible and rigid-flex printed boards?
Answer: IPC-6013
IPC-6013 establishes qualification and performance requirements for flexible and rigid-flex printed boards, including inspection criteria for these substrate types.
During conformal coating inspection, an inspector finds a void under the coating over a through-hole barrel. For a Class 3 product, this is:
Answer: A defect requiring rework
Per IPC-A-610 and IPC-CC-830, voids in conformal coating that expose conductors or joints are defects for Class 3, as they reduce environmental protection.
What is the primary purpose of incoming inspection for electronic components before assembly?
Answer: To confirm component identity, quantity, and conformance to specification before use in production
Incoming inspection verifies that received components match the approved specification, are correctly identified, and meet quality requirements before they enter the production process.
When inspecting a BGA component with X-ray, which defect is most difficult to detect using 2D X-ray alone?
Answer: Head-in-pillow (HIP) defect
Head-in-pillow defects, where the ball and paste fail to coalescence, can appear as normal joints in 2D X-ray because the overlapping shadows obscure the non-wetted interface; 3D CT or cross-section is often needed.
A solder paste print shows insufficient paste volume consistently on the same pad location across multiple boards. What is the most likely root cause?
Answer: Stencil aperture blockage or damage at that location
Consistent low-volume prints at the same aperture location typically indicate a blocked or damaged stencil aperture rather than a process parameter issue.
Per IPC-A-610, which of the following is an acceptable condition for a Class 2 SMT resistor chip component?
Answer: Side overhang is 25% of the component width
IPC-A-610 allows up to 25% side overhang of the component termination width as an acceptable condition for Class 2 chip components.
Which document provides the baseline requirements for cleanliness testing of bare and assembled printed boards?
Answer: IPC-TM-650
IPC-TM-650 is the IPC Test Methods Manual, which includes the standard test procedures (e.g., resistivity of solvent extract) for measuring cleanliness on printed boards.