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CIS Rework, Repair & Modification Flashcards

6 cards from real CIS practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.

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  1. Which IPC standard is the primary reference for rework, repair, and modification of electronic assemblies?

    Answer: IPC-7711/7721

    IPC-7711/7721 (Rework, Modification and Repair of Electronic Assemblies) is the primary IPC standard covering procedures for reworking and repairing PCB assemblies.

  2. What is the key difference between 'rework' and 'repair' in IPC terminology?

    Answer: Rework restores the assembly to original design; repair allows deviation from original design to restore function

    Rework restores the assembly to its original design intent within acceptable workmanship standards; repair involves processes that deviate from original design to restore functional capability.

  3. What is the maximum number of times a through-hole plated barrel may be thermally stressed during rework per IPC-7711?

    Answer: Four times

    IPC-7711 generally limits plated through-holes to a maximum of four thermal excursions (original solder plus up to three rework operations) to prevent barrel fatigue and cracking.

  4. When removing a BGA component for rework, which technique is most commonly used?

    Answer: Localized infrared or hot-air rework station that heats the entire BGA body uniformly

    BGA rework requires a controlled rework station (infrared or hot-air convection) that heats the entire component uniformly to reflow all solder balls simultaneously without damaging adjacent components.

  5. Which tool is used for the controlled removal of desoldering braid (wick) excess from a PCB pad without lifting the land?

    Answer: Low-temperature soldering iron with a chisel tip held at a shallow angle to slide braid off

    A soldering iron at a low angle is used to gently reheat and release desoldering braid from the pad, preventing the mechanical force of pulling that could lift or damage the pad.

  6. What is 'skipping' in the context of wave soldering rework evaluation?

    Answer: A through-hole lead that did not receive solder during wave soldering, leaving an open joint

    A 'skip' or 'solder skip' is a through-hole lead that passed over the wave without receiving solder, resulting in an open (no solder) joint.